Product Overview
The Liquid Cooling Solutions is a chip-level cooling solution designed for AI training clusters, HPC supercomputing centers, and hyper-scale AI data centers with ultra-high-density deployments. The system utilizes specially formulated cooling fluids to directly contact heat-generating chips (CPU, GPU) to remove heat, fundamentally overcoming the cooling capacity limitations of traditional air cooling and effectively supporting rack densities beyond 20kW per rack.
The system employs direct-contact liquid cooling technology, immersing server motherboards in specially formulated cooling fluids, with heat removed through liquid circulation. Coolant Distribution Units (CDU) provide precise distribution and temperature control of the cooling fluid, with support for coordinated operation with air cooling systems to form a complete air-liquid synergy cooling architecture.
Core Features
Ultimate Cooling Capacity
The thermal conductivity of liquid is dozens to hundreds of times that of air, delivering far superior cooling efficiency compared to air-cooled systems. Immersion liquid cooling directly removes the vast majority of heat generated by chips, supporting rack power densities beyond 20kW per rack - effectively meeting the cooling demands of AI training, HPC, and other high-density computing scenarios. System PUE can reach as low as below 1.1, significantly outperforming traditional air-cooled solutions.
High Reliability
Server motherboards are fully immersed in chemically stable, non-conductive cooling fluid, completely isolated from air, moisture, dust, and other environmental factors - fundamentally eliminating the risk of corrosion and contamination to electronic components. The cooling fluid itself exhibits excellent chemical stability, causing no corrosion to electronic components and ensuring long-term stable operation of equipment. This significantly reduces hardware failure rates caused by environmental factors, extends equipment service life, and provides a reliable solution for long-term, high-load operation scenarios.
Energy Efficient & Environmentally Friendly
System cooling energy consumption can be reduced from the conventional 37% of traditional air-cooled systems to approximately 10%, significantly lowering overall data center energy consumption. Under non-compressor operating conditions, only circulation pumps are required, consuming minimal power. No high-power air conditioning systems are needed, greatly reducing cooling equipment investment and operational energy consumption. Additionally, liquid cooling systems can effectively recover server waste heat for building heating or domestic hot water production, enabling cascaded energy utilization and circular economy principles.
Intelligent Monitoring & Management
Equipped with a liquid cooling intelligent monitoring system for real-time monitoring of key parameters including coolant temperature, flow rate, and pressure. Supports coordinated control with air cooling systems for air-liquid synergy dispatch. Supports remote monitoring and centralized management, with communication protocols flexibly configurable based on project requirements for seamless BMS integration. Automatic alerts for abnormal conditions ensure safe and reliable system operation.
Applications
- AI Training Clusters & GPU Computing Clusters
- HPC Supercomputing Centers & Supercomputing Centers
- Hyper-Scale AI Data Centers
- New or Retrofit Projects Requiring Solutions That Overcome Air Cooling Limitations
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Green Data Centers with Strict PUE Requirements
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Hybrid Deployment Scenarios Combining Liquid Cooling with Air Cooling Systems for Air-Liquid Synergy
Technical Advantages
Ultra-High Density Deployment
Supports rack power density beyond 20kW per rack, meeting the compute density demands of AI/HPC scenarios
PUE < 1.1
Cooling energy consumption significantly reduced, industry-leading energy efficiency
Chip-Level Precision Cooling
Direct cooling of core heat-generating chips, eliminating air cooling bottlenecks
Extended Equipment Lifespan
Isolates electronic components from environmental factors, extending server service life
Intelligent Monitoring & Management
Real-time monitoring of key parameters, remote control, and fault prediction
Flexible Communication Configuration
Supports multiple standard protocols, configurable based on project requirements for seamless BMS integration
Waste Heat Recovery
Server waste heat can be utilized for heating or domestic hot water, enabling cascaded energy utilization
System Selection Reference
|
Technology Path |
Application Scenario |
Technical Feature |
|
Immersion Liquid Cooling |
New hyper-scale AI data centers, highest cooling efficiency requirement |
Servers fully immersed in cooling fluid, highest cooling efficiency, optimal PUE |
|
Cold-Plate Liquid Cooling |
Existing air-cooled server room retrofits, gradual upgrades |
Only CPU/GPU chips cooled via liquid cold plates, other components retain air cooling, compatible with existing server architectures |
|
Air-Liquid Synergy |
Partial high-density zones with liquid cooling + remaining zones with air cooling |
Liquid cooling and air cooling systems operate in coordination, addressing both high-density and medium/low-density zones simultaneously |
The Liquid Immersion Cooling Data Center delivers efficient, reliable, and green chip-level cooling solutions for ultra-high-density computing scenarios through cutting-edge direct-contact liquid cooling technology, ultimate cooling capacity, and intelligent management - helping data centers overcome air cooling bottlenecks and achieve PUE < 1.1 energy efficiency targets.
Note: The above system description serves as a reference for standard functionality and architecture, intended to demonstrate core capabilities. Actual project solutions require customized design based on facility scale, power density, cooling fluid selection, and client requirements. Final configurations are subject to project-specific selection. For inquiries, please contact us through any of the channels listed on our "Contact Us" page, and we will provide preliminary solution recommendations based on your specific project needs.
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